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Explore our premium copper alloy products engineered for high-performance thermal management applications across critical industries.
UNS C17200 (also designated CuBe2, CW101C, or Alloy 25) is the most widely used beryllium copper alloy, combining exceptional mechanical strength with outstanding electrical and thermal conductivity — making it the material of choice for demanding thermal management applications.
Key Insight: Beryllium Copper UNS C17200 achieves tensile strengths up to 1,400 MPa after age hardening — the highest of any copper alloy — while retaining thermal conductivity of 105–130 W/m·K, making it irreplaceable in high-power thermal management systems where both structural integrity and heat dissipation are critical.
With thermal conductivity reaching 105–130 W/m·K, C17200 efficiently transfers heat away from critical components, preventing thermal runaway in power electronics and EV battery systems.
Post age-hardening tensile strength up to 1,400 MPa enables thin-section thermal interface components that withstand high mechanical loads without deformation or fatigue failure.
C17200 can be precision-machined into complex heat spreader geometries, spring contacts, and connector housings with tight tolerances critical for modern thermal management assemblies.
Maintains stable mechanical and thermal properties from cryogenic temperatures down to -200°C up to 200°C continuous service, covering virtually all industrial thermal management environments.
Electrical conductivity of 22–28% IACS ensures low resistive heat generation within connectors and bus bars, complementing the alloy's intrinsic thermal dissipation capability.
Excellent resistance to stress relaxation and corrosion ensures long service life in coolant-exposed environments such as liquid-cooled EV battery modules and aerospace thermal control systems.
Precise material data to support your thermal management engineering design and material selection process.
| Property | Value / Range | Condition |
|---|---|---|
| Beryllium Content | 1.80 – 2.00 wt% | Standard Grade |
| Cobalt + Nickel | 0.20 – 0.60 wt% | — |
| Tensile Strength | Up to 1,400 MPa | Aged (AT) Condition |
| Yield Strength (0.2%) | Up to 1,200 MPa | Aged (AT) Condition |
| Hardness | 36 – 45 HRC | Fully Aged |
| Thermal Conductivity | 105 – 130 W/m·K | Aged Condition |
| Electrical Conductivity | 22 – 28% IACS | Aged Condition |
| Density | 8.26 g/cm³ | — |
| Modulus of Elasticity | 128 GPa | — |
| Melting Range | 865 – 980 °C | — |
| Max Service Temperature | 200 °C (continuous) | Aged Condition |
| Available Forms | Rod, Bar, Strip, Sheet, Plate, Tube, Wire | Custom Sizes Available |
The global demand for Beryllium Copper C17200 in thermal management is accelerating, driven by electrification, miniaturization, and the push for higher power densities across multiple industries.
The explosive growth of the EV market — projected to exceed 45 million units annually by 2030 — is creating unprecedented demand for high-performance thermal interface materials. C17200 beryllium copper is increasingly specified for battery module busbars, thermal contact springs, and power electronics housings where both heat conduction and mechanical spring force are simultaneously required. Leading EV OEMs in Europe, North America, and China are actively qualifying C17200 components for next-generation 800V battery architectures.
5G base stations and Massive MIMO antenna arrays generate significantly higher localized heat flux than 4G systems. C17200 beryllium copper is being adopted for RF connector thermal management, heat spreader springs in active antenna units (AAUs), and precision thermal contact elements in small-cell deployments. The global 5G infrastructure investment exceeding $300 billion through 2025 represents a major growth vector for C17200 thermal management components.
The rapid scaling of AI accelerator chips (GPUs, TPUs, NPUs) has pushed package-level thermal design power (TDP) to 700W+ per chip. C17200 beryllium copper is being evaluated and deployed in advanced heat spreader lids, spring-loaded thermal interface clamping mechanisms, and vapor chamber support structures where its unique combination of stiffness, conductivity, and fatigue resistance outperforms all alternative copper alloys.
Avionics thermal management in next-generation military and commercial aircraft demands materials that maintain dimensional stability under extreme thermal cycling. C17200 beryllium copper is specified for radar system thermal management, satellite thermal control structures, and missile guidance electronics housings. The non-sparking property of beryllium copper also makes it the material of choice for hazardous environment thermal management enclosures.
The beryllium copper industry is investing heavily in closed-loop recycling processes. C17200 scrap recovery rates now exceed 90% in advanced manufacturing facilities, significantly reducing the environmental impact of beryllium extraction. Lifecycle analysis studies confirm that C17200 components, due to their exceptional longevity and recyclability, offer a lower total environmental footprint than many competing thermal management material alternatives over a 10-year service horizon.
The global beryllium copper market was valued at approximately $500 million in 2023 and is forecast to grow at a CAGR of 6.8% through 2030, with thermal management applications representing the fastest-growing segment. Asia-Pacific, led by China's EV and electronics manufacturing ecosystem, accounts for over 40% of global C17200 consumption and continues to expand its share of both production and end-use demand.
Beryllium Copper UNS C17200 enables critical thermal management solutions across the most demanding industrial and commercial sectors worldwide.
C17200 spring contacts and busbars maintain consistent thermal contact pressure across battery cell arrays, ensuring uniform heat distribution and preventing localized hotspots that degrade cell chemistry and cycle life.
Precision-machined C17200 heat spreader lids for IGBT modules, SiC power devices, and GaN transistors leverage the alloy's conductivity and stiffness to achieve junction-to-case thermal resistance values unattainable with standard copper.
In 5G mmWave transceivers and phased-array radar systems, C17200 beryllium copper spring fingers provide simultaneous electrical grounding and thermal conduction between RF modules and chassis heat sinks.
Burn-in socket contacts and test probe tips fabricated from C17200 withstand tens of millions of thermal cycles while maintaining precise contact force, ensuring reliable thermal coupling between DUT and temperature-controlled test fixtures.
High-power laser cutting heads and plasma torch nozzles require materials that simultaneously conduct heat away from the cutting zone and resist thermal fatigue. C17200 components extend service intervals by 3–5× compared to conventional copper in these applications.
Satellite thermal straps, avionics cold plate mounting springs, and spacecraft electronic enclosure thermal interface elements fabricated from C17200 maintain performance across the full vacuum-to-atmosphere thermal cycling environment of space missions.
Grid-scale lithium battery energy storage systems rely on C17200 beryllium copper for inter-cell thermal management connectors and battery management system (BMS) sensor contact springs that must maintain precise contact resistance and heat transfer over 20+ year design lifetimes.
High-current relay contacts manufactured from C17200 benefit from the alloy's combination of hardness, conductivity, and thermal stability, enabling compact relay designs with superior heat dissipation and longer contact life under repetitive switching loads.
MRI gradient coil thermal management components, CT scanner X-ray tube heat exchangers, and analytical instrument thermal stabilization elements leverage C17200's biocompatibility, precision machinability, and stable thermal performance in controlled medical environments.
Sichuan Kepai New Materials Co., Ltd., established in 2017, is a high-tech enterprise integrating research and development, production, and sales. Currently, the factory covers an area of approximately 9,000 square meters, with an office space of about 1,000 square meters. The company primarily engages in the production of strategic emerging new materials for the national 13th Five-Year Plan, including special copper alloys such as tellurium copper, high-conductivity oxygen-free copper, silver copper, and dispersion copper, while also focusing on the research and development of high-conductivity, easy-to-machine, high-strength copper alloys. The products are mainly applied in high-tech fields such as new energy vehicles, 5G technology, laser cutting, and lithium battery relays.
Four pillars that make Kepai the trusted partner for Beryllium Copper C17200 thermal management solutions globally.
Technological innovation is the core competitiveness of Sichuan Kepai New Materials Co., Ltd. The company has a research and development and production team composed of senior industry experts who keep pace with international cutting-edge technology trends and continuously explore the unknown boundaries in the field of new copper alloy materials. Through a combination of independent research and development and industry-university-research collaboration, Kepai has made breakthrough progress in several areas, including high-performance tellurium copper, lead copper, and sulfur copper. Many of its technological achievements have reached international advanced levels and have been successfully applied in various industries such as new energy vehicles, precision machining parts, plasma cutting, relays, and energy storage, earning widespread recognition and praise in the market.
Kepai's product line is rich and diverse, covering a comprehensive range of solutions from basic materials to high-end customization. We focus on providing customers with high-performance, high-quality high-end copper alloy products, including but not limited to pure copper, oxygen-free copper, oxygen-free high-conductivity tellurium copper, nickel tellurium copper, tin bronze, beryllium copper, lead bronze, sulfur copper, and chromium zirconium copper. These products play an important role in reducing production costs and enhancing product performance due to their excellent physical and chemical properties and environmental friendliness, creating significant economic and social benefits for customers.
In the face of global market competition, Sichuan Kepai New Materials adheres to the development strategy of "rooted in Sichuan, radiating nationwide, and moving towards the world." By continuously optimizing market layout and improving the sales network, we have established a stable customer base in multiple provinces and cities across the country and have formed long-term cooperative relationships with several internationally renowned enterprises. At the same time, the company actively expands into overseas markets, participates in international competition and cooperation, and strives to promote Kepai's brand influence on the global stage.
We understand that the long-term development of an enterprise is inseparable from an excellent corporate culture. We advocate the corporate spirit of "integrity, innovation, collaboration, and win-win," encouraging employees to explore boldly and innovate courageously, while also emphasizing teamwork and talent cultivation, striving to create a harmonious, open, and inclusive work atmosphere. We believe that only by continuously pursuing excellence and creating value can we win the trust of customers and the respect of society.
The company is located in the western area of the Sichuan Guanghan Industrial Development Zone, adjacent to National Highway 108, boasting a superior geographical location and convenient transportation, which lays a solid foundation for the rapid development of the enterprise. Since its establishment, Kepai has adhered to the business philosophy of "innovation-driven development, quality wins the market," committed to providing customers with the highest quality high-end copper alloy materials, and promoting industrial upgrading and sustainable development.
State-of-the-art manufacturing and testing equipment ensures every batch of Beryllium Copper C17200 meets the most stringent thermal management specifications.
Smelting
Laying-off
Extrusion
Drawing
Straightening
Package
Eddy Current Conductance Instrument
Chemical Composition Test Room
Metallographic Sample Polishing Machine
Microcomputer Controlled Electro-Hydraulic Servo Universal Testing Machine
Liquid Crystal Display Electronic Universal Testing Machine
Hardness Tester
Kepai's quality management system and global market reach are backed by internationally recognized certifications and a proven track record across diverse industries.
Discover our full range of high-performance copper alloy solutions designed for thermal management, precision machining, and advanced industrial applications.
High Performance Oxygen Free Copper — Thermal Conductor
Free-Cutting Sulfur Copper — Heat Sink Precision Parts
High Performance Beryllium Copper Alloy — C17200 Thermal Grade
C10100 Oxygen-Free Copper Tube — Cooling System Solutions
C14700 Sulfur Copper — Efficient Thermal Interface Material
Beryllium Copper C17300 — Thermal Management Alternative
High Performance Tellurium Copper — Conductive Thermal Material
OFT Oxygen Free High Conductivity Tellurium Copper — Thermal Grade
Looking ahead, Sichuan Kepai New Materials Co., Ltd. will continue to uphold its original intention, with even greater enthusiasm and determination, to engage in research and application in the field of new materials, contributing to the development of the new copper alloy materials industry in China and globally. We look forward to working hand in hand with friends from all walks of life to create a brilliant future together!
