High purity oxygen-free copper

Oxygen-free Copper (oxygen-free Copper, OFC) through vacuum melting + carbon reduction process, Oxygen content ≤0.001% (10 ppm), purity up to 99.99%, completely eliminate the interference of copper oxide (Cu₂O) on conductivity. Its electrical conductivity is ≥101% IACS, which is significantly improved compared with ordinary copper (100% IACS), and can reduce high-frequency signal transmission loss, which is suitable for 5G communication base stations, satellite RF components and other scenarios.

Product Detail

Technical features: stable and reliable, suitable for harsh environment

Hydrogen brittleness resistance: no grain boundary oxide, avoid reaction with hydrogen to form bubbles, suitable for vacuum tubes, particle accelerators and other equipment.
Super ductility: elongation > 40%, support stamping into 0.03mm ultra-thin foil for flexible circuit board (FPC) substrate.
High temperature resistance: no grain boundary oxidation risk below 400℃, to meet the needs of semiconductor sputtering target high temperature coating.

Application scenario: Solve industry pain points

Chip manufacturing: C10100 oxygen-free copper target is deposited uniformly, improving the yield of wafer metallization layer.
High-frequency cable: OFC coaxial cable reduces signal attenuation and ensures the stability of millimeter-wave radar data transmission.
Superconducting equipment: OFHC oxygen-free copper coil resistance approaches zero, supporting efficient operation of MRI magnets.

High performance oxygen free copper

Characteristics and application of high performance tellurium copper