Metallographic Distribution of Tellurium Copper

Composition and structure: The copper content in tellurium-copper alloys is usually high. Tellurium, as the main additive element, its content affects the performance and microstructure of the alloy. Tellurium-copper alloys have excellent mechanical properties and corrosion resistance, and are suitable for precision instruments and electronic components.

Microstructure: The metallographic structure of tellurium-copper mainly consists of the copper matrix and tellurides. Under a microscope, the copper matrix appears as a bright white color, while the tellurides may be distributed in the matrix in the form of dots, blocks, or networks. The morphology and distribution of the tellurides are influenced by the alloy composition, heat treatment process, and cooling rate.

Heat treatment effects: Through various heat treatment processes, such as annealing, quenching and tempering, the microstructure of tellurium-copper can be altered, thereby influencing its properties. For instance, proper heat treatment can enable the uniform distribution of tellurides, enhancing the mechanical properties of the alloy.

Application field: Tellurium-copper alloys are widely used in the electronics industry, especially in situations where good electrical conductivity and mechanical strength are required. The uniformity and stability of its microstructure are the key factors ensuring its performance.