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Material Overview
Oxygen Free Copper (OFC) plate is a premium-grade copper material produced through advanced vacuum or inert-atmosphere casting and rolling processes that effectively eliminate dissolved oxygen content to below 0.001% (10 ppm). This ultra-low oxygen content dramatically enhances the metal's electrical and thermal conductivity, ductility, and resistance to hydrogen embrittlement — making it the material of choice for high-performance electrical connectors and terminals across a wide range of industries.
Designated under standards such as ASTM C10100 (OFE) and C10200 (OF), oxygen free copper plates are characterized by their exceptionally smooth grain structure, superior surface finish, and outstanding formability. These properties allow precision stamping, deep drawing, and CNC machining to produce intricate connector geometries and terminal profiles with tight tolerances — essential for modern high-density electronic assemblies.
Unlike standard copper grades, OFC plates exhibit near-zero gas porosity, which means solder joints and brazed connections achieve higher mechanical integrity and lower contact resistance. This is particularly critical in applications where micro-ohm-level resistance variations can affect system performance, such as in semiconductor test sockets, automotive ECU connectors, and high-frequency RF terminals.
Technical Advantages
With conductivity exceeding 101% IACS, OFC plates ensure minimal resistive losses in connector contacts and terminal strips, critical for power distribution and signal integrity applications.
Thermal conductivity of ~391 W/m·K enables efficient heat dissipation in high-current terminals, preventing thermal runaway and extending service life in power connectors.
The near-zero oxygen content eliminates the risk of hydrogen embrittlement during brazing or annealing, ensuring structural integrity of connectors in high-temperature manufacturing environments.
OFC plates offer outstanding cold-working and stamping characteristics, enabling the production of complex terminal geometries with precision tolerances as tight as ±0.01mm.
Reduced oxygen content minimizes internal oxidation, improving long-term stability of electrical contact surfaces and reducing maintenance requirements in harsh operating environments.
OFC plates are lead-free and fully compliant with RoHS, REACH, and other international environmental regulations, supporting sustainable manufacturing practices in global supply chains.
Market Intelligence
The global oxygen free copper market for connector and terminal applications has witnessed robust growth over the past decade, driven by accelerating electrification across automotive, telecommunications, consumer electronics, and industrial automation sectors. According to industry analyses, the global copper connector and terminal market was valued at over USD 8.5 billion in 2023 and is projected to surpass USD 14 billion by 2030, with OFC-grade materials accounting for a growing share as performance requirements intensify.
Asia-Pacific — led by China, Japan, South Korea, and Taiwan — dominates both production and consumption of OFC plates for connectors, owing to the dense concentration of electronics manufacturing, EV production, and 5G infrastructure deployment. China alone accounts for approximately 45% of global OFC plate consumption, with demand surging from new energy vehicle manufacturers, battery connector suppliers, and 5G base station equipment producers.
The explosive growth of the NEV industry has become the single most transformative driver for OFC plate demand in connector applications. A single electric vehicle contains between 800 and 1,500 electrical connectors, many of which require OFC-grade materials to handle high-current loads (up to 800A in fast-charging systems), maintain low contact resistance across thousands of mating cycles, and withstand thermal cycling from -40°C to +150°C. Battery management system (BMS) busbars, high-voltage interlock connectors, and charging inlet terminals are all prime applications where OFC plates deliver decisive performance advantages over standard copper grades.
The global rollout of 5G networks has created unprecedented demand for high-frequency RF connectors and terminal components that can operate reliably at millimeter-wave frequencies (24–100 GHz). At these frequencies, even minor impurities or grain boundary defects in connector materials cause measurable signal attenuation and impedance mismatch. OFC plates, with their homogeneous microstructure and superior conductivity, are the preferred substrate for precision-machined RF connector bodies, coaxial terminal pins, and antenna feed-through components in 5G base stations, small cells, and active antenna units (AAUs).
Future Outlook
Advanced severe plastic deformation (SPD) techniques such as equal-channel angular pressing (ECAP) are being applied to OFC plates to refine grain structures to the nanometer scale, achieving simultaneous improvements in strength and conductivity — previously considered mutually exclusive properties. This enables thinner, lighter connector terminals without sacrificing current-carrying capacity.
Machine learning algorithms integrated with real-time eddy current testing and X-ray fluorescence (XRF) analysis are revolutionizing OFC plate quality assurance. AI-powered defect detection systems can identify sub-surface voids, inclusions, and compositional variations at production speeds exceeding 100 meters per minute, ensuring consistent quality for high-reliability connector applications.
As global power grids transition toward HVDC transmission for renewable energy integration, the demand for ultra-high-purity OFC plates in HVDC connector and terminal assemblies is accelerating. HVDC connectors operating at voltages above 500kV require exceptional dielectric properties and near-perfect conductivity — specifications that only OFC-grade materials can reliably meet.
Leading OFC plate manufacturers are adopting closed-loop recycling systems that recover and reprocess copper scrap from connector stamping operations with purity recovery rates exceeding 99.97%. Combined with renewable-energy-powered smelting facilities, these initiatives are significantly reducing the carbon footprint of OFC plate production while maintaining the stringent purity standards demanded by connector manufacturers.
The exponential growth of AI data centers and advanced semiconductor packaging (chiplets, 3D-IC) is driving demand for ultra-precision OFC terminal strips and lead frames capable of handling terahertz-range signal frequencies. Next-generation AI accelerator chips require connector interfaces with contact resistance below 1 mΩ and insertion loss below 0.1 dB at 56 Gbps — performance metrics that mandate OFC-grade substrate materials.
Utility-scale battery energy storage systems (BESS) for grid stabilization require massive busbar and terminal assemblies carrying currents in excess of 10,000A. OFC plates are increasingly specified for these applications due to their combination of maximum conductivity, excellent weldability, and long-term electrochemical stability in electrolyte-adjacent environments.
Application Scenarios
Among the most demanding applications for OFC plates is the lithium battery relay terminal — a component that must reliably interrupt currents exceeding 500A under fault conditions while maintaining contact resistance below 0.5 mΩ throughout a service life of over 100,000 switching cycles. OFC plates machined and stamped into relay contact arms achieve this demanding specification through their combination of high conductivity (minimizing resistive heating), excellent spring-back characteristics (ensuring consistent contact force), and superior surface finish (reducing micro-arc erosion at contact interfaces).
Kepai's high-conductivity oxygen-free copper products have been specifically engineered for this application, with precisely controlled oxygen content, grain size distribution, and cold-work hardening levels that optimize the balance between conductivity and mechanical strength required for relay terminal performance.
About Us
Sichuan Kepai New Materials Co., Ltd., established in 2017, is a high-tech enterprise integrating research and development, production, and sales. The factory covers an area of approximately 9,000 square meters, with an office space of about 1,000 square meters. The company primarily engages in the production of strategic emerging new materials, including special copper alloys such as tellurium copper, high-conductivity oxygen-free copper, silver copper, and dispersion copper, while also focusing on the research and development of high-conductivity, easy-to-machine, high-strength copper alloys. The products are mainly applied in high-tech fields such as new energy vehicles, 5G technology, laser cutting, and lithium battery relays.
Our Philosophy
The company is located in the western area of the Sichuan Guanghan Industrial Development Zone, adjacent to National Highway 108, boasting a superior geographical location and convenient transportation, which lays a solid foundation for the rapid development of the enterprise. Since its establishment, Kepai has adhered to the business philosophy of "innovation-driven development, quality wins the market," committed to providing customers with the highest quality high-end copper alloy materials, and promoting industrial upgrading and sustainable development.
Why Choose Us
Technological innovation is the core competitiveness of Sichuan Kepai New Materials Co., Ltd. The company has a research and development and production team composed of senior industry experts who keep pace with international cutting-edge technology trends and continuously explore the unknown boundaries in the field of new copper alloy materials. Through a combination of independent research and development and industry-university-research collaboration, Kepai has made breakthrough progress in several areas, including high-performance tellurium copper, lead copper, and sulfur copper. Many of its technological achievements have reached international advanced levels and have been successfully applied in various industries such as new energy vehicles, precision machining parts, plasma cutting, relays, and energy storage, earning widespread recognition and praise in the market.
Kepai's product line is rich and diverse, covering a comprehensive range of solutions from basic materials to high-end customization. We focus on providing customers with high-performance, high-quality high-end copper alloy products, including but not limited to pure copper, oxygen-free copper, oxygen-free high-conductivity tellurium copper, nickel tellurium copper, tin bronze, beryllium copper, lead bronze, sulfur copper, and chromium zirconium copper. These products play an important role in reducing production costs and enhancing product performance due to their excellent physical and chemical properties and environmental friendliness, creating significant economic and social benefits for customers.
In the face of global market competition, Sichuan Kepai New Materials adheres to the development strategy of "rooted in Sichuan, radiating nationwide, and moving towards the world." By continuously optimizing market layout and improving the sales network, we have established a stable customer base in multiple provinces and cities across the country and have formed long-term cooperative relationships with several internationally renowned enterprises. At the same time, the company actively expands into overseas markets, participates in international competition and cooperation, and strives to promote Kepai's brand influence on the global stage.
We understand that the long-term development of an enterprise is inseparable from an excellent corporate culture. We advocate the corporate spirit of "integrity, innovation, collaboration, and win-win," encouraging employees to explore boldly and innovate courageously, while also emphasizing teamwork and talent cultivation, striving to create a harmonious, open, and inclusive work atmosphere. We believe that only by continuously pursuing excellence and creating value can we win the trust of customers and the respect of society.
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Looking ahead, Sichuan Kepai New Materials Co., Ltd. will continue to uphold its original intention, with even greater enthusiasm and determination, to engage in research and application in the field of new materials, contributing to the development of the new copper alloy materials industry in China and globally. We look forward to working hand in hand with friends from all walks of life to create a brilliant future together!
