Oxygen Free High Conductivity Tellurium Copper - Premium Quality from China Suppliers and Factory
The oxygen free high conductivity tellurium copper has extremely low oxygen content (the oxygen content level is equivalent to TU0 / C10200, less than 10ppm), great mechanical, physical and fabrication properties:
| Property / Parameter | Unit / Condition | Value / Specification |
|---|---|---|
| Tensile Strength | RmMpa | ≥260 |
| Yield Strength | δ0.5Mpa | ≥205 |
| Elongation | % | ≥12 |
| Coefficient of elasticity | Mpa | 117000 |
| Heat conductivity coefficient | W/(m·K) | 415 |
| Electrical Conductivity | %IACS | ≥97 |
| Hardness | HRB | 30-55 |
| Softening temperature | - | 350℃ |
| Capacity for being cold worked | - | Excellent |
| Capacity for being hot formed | - | Excellent |
| Hot working temperature | - | 750-875℃ |
| Annealing temperature | - | 425-650℃ |
- Hardware processing industry: complex, precision electrical components. Precision machining parts
- Cutting and welding industry: Plasma and laser welding nozzle
- Medium and low voltage industry
- Automotive components: Contact and contact of automobile electromagnetic switch
- New energy industry
- Power connections: Automotive terminal, high current charging gun connector, lithium ion battery pole.
In fields such as 5G communications and semiconductor packaging, conventional copper materials are prone to hydrogen embrittlement due to high oxygen content, leading to device failure. Our oxygen-free high-conductivity tellurium copper, with an oxygen content of ≤0.003% and micro-alloyed with tellurium, eliminates the risk of hydrogen embrittlement while maintaining industry-leading electrical conductivity.
OFT copper is an advanced copper alloy developed with independent intellectual property rights. It features extremely low oxygen content (less than 10ppm) combined with tellurium micro-alloying, offering high electrical conductivity, excellent machinability, and resistance to hydrogen embrittlement.
Conventional copper materials contain higher oxygen levels, making them susceptible to hydrogen embrittlement in high-temperature environments. Our OFT copper limits oxygen content to ≤0.003% (equivalent to TU0/C10200), eliminating the risk of hydrogen embrittlement and subsequent device failure.
It is highly suitable for precision hardware processing, plasma and laser welding nozzles, low/medium voltage applications, electromagnetic switches, and new energy components such as lithium-ion battery poles and high-current charging gun connectors.
Our oxygen-free tellurium copper achieves an electrical conductivity of ≥97% IACS and a thermal conductivity coefficient of 415 W/(m·K), ensuring optimal efficiency for electrical and thermal transmission.
OFT copper provides excellent cold-working and hot-forming capabilities. It offers extremely easy cutting with non-stick tool properties, making it ideal for high-speed precision manufacturing.